NXP Semiconductors BB249 Package Shape: ROUND Package Style: LONG FORM Surface Mount: Yes Terminal Form: WRAP AROUND Terminal Position: END Number of Terminals: 2 Package Body Material: GLASS Configuration: SINGLE Case Connection: ISOLATED Number of Elements: 1 Diode Element Material: SILICON Diode Type: VARIABLE CAPACITANCE DIODE Frequency Band: VERY HIGH FREQUENCY Breakdown Voltage-Min: 30 V Diode Capacitance Ratio-Min: 8